55nm & 65nm
- RP65: Multi-Voltage GPIO with PWM, I2C/SVID open-drain, 3.3V/5V analog & OTP
- AJ65: I2C/I3C fail-safe GPIO wirebond digital & analog library
- IS55: Specialized 20V analog ESD cell
- AV55: Low-Capacitance RF ESD cell library
- TE55: 0.9V/2.5V SoundWire audio I/O Library
- TF55: 0.9V/1.2V SoundWire audio I/O Library with auto delay calibration
28nm
- DG28: Switchable 1.8V/3.3V GPIO with 5V I2C ODIO, HDMI/LVDS protection, analog & OTP in HPM/HPC/HPC+
- VG28: Switchable 1.8V/3.3V GPIO
- TG28: Fail-Safe 1.8V/3.3V Multi-Voltage GPIO with embedded XTAL oscillator
- <4Gbps Low Power D2D Interface in TSMC 28nm
- 2Gbps SLVS Transceiver in TSMC 28nm
- 2Gbps LVDS Transceiver in TSMC 28nm
- WD28 / SC28: sub-80fF ESD macro for multi-gigabit SerDes (wirebond / flipchip)
- Footprint Options Brochure
22nm
- MM22: Ultra-Low Leakage dynamic 1.8V/3.3V GPIO with I2C ODIO & analog, up to xSPI400
- PM22: Ultra-Low Leakage 1.8V GPIO with I2C ODIO & analog
- VG22: 1.8V/3.3V multi-voltage GPIO with 5V ODIO & analog
- OG22: Three-speed 1.8V/3.3V GPIO library with I2C ODIO (8kV HBM)
- EG22: 1.8V/3.3V GPIO with 5V ODIO, HDMI, LVDS & analog cells
- TA22: 200Mbps 0.9V SLVS Transceiver
- Footprint Options Brochure
16/12nm
- RS16: Controlled Impedance Multi-Protocol I/O Library (HP, HV, RCAL Macros)
- UF16: Switchable 1.8V/3.3V GPIO with 5V ODIO, OTP & analog
- AD16: 11.8V/3.3V flip-chip I/O Library with I2C ODIO & 5V Hot-Plig Detect (4kV HBM)
- <4Gbps Low Power D2D Interface in TSMC 16nm FFC/FFC+
- VX16: Low-Power die-to-die interface
- 2Gbps SLVS/LVDS Combo Transceiver in TSMC 16nm FFC/FFC+
- AF12: 1.8V/3.3V flip-chip I/O library with I2C ODIO & 5V Hot-Plug Detect
- MH12: Hardened 1.8V/3.3V GPIO & power library with integrated POC
- 5V I/O and ESD in TSMC 12nm